Engineering Materials for Semiconductor Manufacturing Equipment: Properties, Applications, and Future Trends
DOI:
https://doi.org/10.63282/3050-922X.IJERET-V7I2P119Keywords:
Metals & Alloys, Ceramics, Polymers & Elastomers, Composites, Thermal Conductivity, Low Thermal Expansion, Thermal Shock Resistance, High Temperature Stability, Mechanical Strength & Stiffness, Fatigue Resistance, Dimensional Stability, Plasma Resistance, Chemical Inertness, Low Sputter Yield, Erosion ResistanceAbstract
Semiconductor manufacturing equipment operates under extreme thermal, chemical, mechanical, and plasma environments that demand exceptional material performance. As device geometries shrink and process windows tighten, the selection, engineering, and integration of materials have become central to equipment reliability, yield, and cost of ownership. This paper presents a comprehensive study of engineering materials used in semiconductor manufacturing equipment, examining their structural, thermal, chemical, and plasma‑interaction properties [1]–[3]. The analysis highlights metals, ceramics, polymers, composites, and emerging advanced materials [6], [7], [10], emphasizing their roles in deposition, etch, lithography, metrology, and wafer‑handling subsystems. The study concludes with future material trends driven by EUV lithography, advanced packaging, heterogeneous integration, and sustainability requirements [12]–[17].
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